本計劃以高功率近紅外雷射作為熱源，照射於高功率LED封裝基板上以模擬高功率LED產生之廢熱，由於雷射光源之高度彈性，可以以不同之功率以及光形分佈之高度適應性以模擬各種熱源分佈；而後藉由紅外線熱像儀觀察LED封裝基板之溫度分佈以求得封裝基板之熱阻，並以有限元素分析法同時進行數值模擬以估計封裝基板內部之介面熱阻；第一年將著重於單一LED晶片封裝熱特性研究、建立穩態熱阻量測流程、樣品表面塗層開發與量測環境造成誤差之研究。第二年將著重於以光學系統模擬多LED晶片封裝基板之熱阻量測、脈衝模式操作LED模擬、並對脈衝加熱熱阻量測或近似穩態加熱熱阻量測進行理論與實驗之研究。 This project purposes utilizing high power near-infrared laser as the heating source illuminating on high power LED package subtracts to simulate the waste heat generation of high power LED experimentally. By means of the highly flexibility of laser light, different laser power and beam profile distribution make possible adaptively simulate heat source distribution in various cases. Thermal images of the illuminated subtract can be taken and its thermal resistance can then be calculated correspondingly. At the meantime, model of the subtract will be analyzed by finite element analysis to estimate the interface thermal resistance inside the subtract. The work of the first year will be focused on single LED chip package subtract thermal resistance measurement, standardized the measurement procedure, subtract surface treatment development and error analysis due to environmental condition. In the second year, we will devote to development the optical system for simulate multiple LED chip package and measure its thermal resistance as well as pulsed operate LED simulation and study the possibility of pulsed heating thermal resistance measurement and quasi-steady heating thermal resistance measurement. 研究期間：9901 ~ 9912
