訂單處理流程在半導體封裝廠之物流資訊系統設計; Logistic Information System Design of Order Fulfillment Process in IC Packaging

NCUIR > School of Management at National Central University > Graduate Institute of Industrial Management > Electronic Thesis & Dissertation > Item 987654321/10916

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/10916

Title:	訂單處理流程在半導體封裝廠之物流資訊系統設計;Logistic Information System Design of Order Fulfillment Process in IC Packaging
Authors:	曾俊龍;Chung-Lung Tsneg
Contributors:	工業管理研究所
Keywords:	order fulfillment process (OFP);logistic information system (LIS);Supply Chain Management (SCM;Integrated Circuit Packaging (ICP);Architecture of integrated Information System (ARI
Date:	2000-07-04
Issue Date:	2009-09-22 14:09:50 (UTC+8)
Publisher:	國立中央大學圖書館
Abstract:	In recent years, Integrated Circuit Packaging (ICP) companies in Taiwan have been incredibly thriving due to the growth of semiconductor industry, which has been considered reaching to the stage of maturity. Meanwhile, in order to meet the challenges of intense competition, globalization and gaining greater market share, most ICP companies have increased in size and complexity of business operations. For instance, when multiple-plant operation is replacing single-plant production, the distribution of products from point-of-origin to point-of-consumption has become one of the most important issues. Being perceived as the subject of Supply Chain Management (SCM), how to deliver quality products to the customer in right quantity, at the right time, and with minimum cost is the necessary capability that determines a company’s survival in today’s dynamic business environment. In other words, establishing and maintaining a robust logistic system becomes a most significant competition strategy. Therefore , to enhance logistic system of customer satisfaction , establishment of a complete real-time and multi-function logistic information system (LIS) is must priority for short cycle time and On-Time-Deliver of order fulfillment process (OFP) in IC packaging companies . We provide an innovative modeling technique called Architecture of integrated Information System (ARIS) to model the order fulfillment process .The special features of ARIS are comprised of Function View, Organization View, Data View, and Control View, that is functional, organization, informational, and behavior, to model dynamic process at the same time. The implementation of logistic information system of order fulfillment process can lead to improving shorten cycle time and on-time-deliver for customer service . The logistic information system that link the firm with its vendors, suppliers, subcontractors also offer significant opportunities for profit improvement .
Appears in Collections:	[Graduate Institute of Industrial Management] Electronic Thesis & Dissertation

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